Design rules for batch spraying
Co-Authors and contributors
- Dr Lee Hitchens, Nexus
- Karl Hardcastle, SCH Technologies
Spraying conformal coating with a spray gun is a technical process without doubt.
However, for the design of the circuit board it is probably the least challenging and simplifies the guidelines and design rules.
Here are a list of rules and guidelines that could be considered.
- Match the conformal coating to the spray process
- Fill the via’s to avoid capillary flow
- Avoid 3D Problems with components
- Include space for masking
- Press fit connectors
- Use the correct components
- Apply silicone RTV after conformal coating
Match the conformal coating to the spray process
Avoid using masking materials and UV cure coatings in the batch process. This is due to the UV cure coating potential to dry hard and not allow the masking material to be removed.
Fill the via’s to avoid capillary flow
Avoid open via’s beneath connectors since capillary of coating can allow penetration through to the other side.

Avoid 3D Problems with components
Don’t specify coating 3D components unless you really must. If so, ensure you apply several thin layers to avoid coating running or building up.
Include space for masking
Allow 2-3mm around components that must be masked that it doesnt matter if it is coated or not.
Ensure adequate spacing between a component that needs to be coated next to a component that needs to masked.

For example, do not place small resistors adjacent to a connector that will be masked down to the board surface or the resistor may not be coated.
Press fit connectors
Press fit connectors can be installed after liquid coating the board and the barrels if completed quickly. The pins will have sufficient contact when inserted.
Use the correct components
Use the male header pin type connectors that can be masked easily with boots rather than the female sockets which cannot be easily.

Apply silicone RTV after conformal coating
Apply RTV after conformal coating to avoid de-wetting issues.
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